鴻浩科技有限公司Hong how Technology Co., Ltd.

半導體IC封裝材料:Spin Coating Type  

半導體IC封裝材料:Dry Film Roller Type DAF

電子材料:

產品製程工藝簡介...

 (1) Wafer Backside Spin Coating Die Attach Material Process

      1.Full Auto Wafer Backside Coating Process

              Youtube : https://www.youtube.com/watch?v=ZnaB3XZ3EOE

              Youku    : http://v.youku.com/v_show/id_XNTAxMDc0MzMy.html?spm=a2hzp.8253869.0.0

          2.Semi-Auto Wafer Backside Coating Process

              Youtube:

                  Silver Conductivity Spray Spin Coating

                https://www.youtube.com/watchv=UXuVS5G8sqE&feature=youtu.be

                        Non-Conductivity Spray Spin Coating

             https://www.youtube.com/watch?v=F3zMkxDeFfw

               Youku:

              http://v.youku.com/v_show/id_XNjgwMzk5MTg0.html?spm=a2h0j.8191423.module_basic_relation.5~5!2~5~5!18~5!2~1~3~A

 (2) Wafer Backside  Roller Type Pre Cut DAF Lamination Process

     1. 8inch Wafer Backside Coating Roller Type DAf Lamination Process

            Youtube : https://www.youtube.com/watch?v=WY0Yai8SwrY

            Youku: http://v.youku.com/v_show/id_XMjY5Mzc3NDUwNA==.html?spm=a2hzp.8244740.userfeed.5!7~5~5~5!3~5~A         

將關於這個 Web 站台的問題或建議的郵件寄到 nancy@hong-how.com.tw 。
上次修改日期： 2017年06月28日